Information
JOURNAL OF SHENZHEN UNIVERSITY SCIENCE AND ENGINEERING
(Started in 1984, Bimonthly)
Responsible Institution
Shenzhen University
Sponsor
Shenzhen University
Edited by
Editorial Department of Journal of Shenzhen University Science and Engineering
Science Press
Chief editor
Li Qingquan
Distributed Domestically
Shenzhen Post Office
Distributed Abroad
China International Book Trading Corporation,(P.O.Box 399.Beijing,P.R.China)
Address
16 Donghuangchenggen North Street, Beijing 100717, P.R. China
Tel
0755-26732266
0755-26538306
Email:
journal@szu.edu.cn
 The Journal of Shenzhen University Science and Engineering is a general science and technology academic journal, managed and produced by Shenzhen University, and published by Science Press.It was first published in 1984. It is issued on a bimonthly basis (appearing on odd months) as an A4, 112-page magazine, distributed both domestically and overseas.
  The Journal publishes articles and letters covering a wide range of fields, including optoelectronic engineering, electronics & information science, architecture & civil engineering, chemistry & chemical engineering, automation & precision instruments, materials science, mathematics, physics, bioengineering, environmental science & energy, and food safety.
  The Journal is recognized as a core Chinese science and technology journal by the Overview of Core Chinese Periodicals (published by the Peking University Library) and the Statistical Source Journal for Chinese Science and Technology Articles (published by the Institute of Scientific and Technical Information of China [ISTIC]). It is also indexed by many authoritative domestic and international databases, including the Chinese Science Citation Database (CSCD), the Annual Report for Chinese Academic Joural Impact Factors (Natural Science), SCOPUS (based in the Netherlands), and Zentralblatt MATH (based in Germany). The Journal’s 2017 impact factor was 0.829, and the 2017 5-year impact factor was 0.877.
  We warmly welcome high-quality contributions from researchers and scholars from around the world!
Current Issue
Accepted Paper
In Press
Materials Science
ZHANG Han1, ZOU Jifei1, LUO Shaojuan1, HUANG Yang2, and FAN Dianyuan1
LI Chengyin1, NIU Zhihui1, LEI Xiangyu1, ZHOU Yan1, ZHANG Han2, and ZHU Xi1
LI Chun, HU Xiaoying, HE Tianying, SUN Peihua, and LAN Changyong
XING Jianbo1,2, CEN Yuan1,2, YIN Xue1, DU Yu2, and PAN Qinhe1
GAO Zhihui1, FANG Ruiyang2, LI Hui2, HE Wei3, LI Ling2, and LIN Weihao3
GUI Dayong, LIU Canqun, ZONG Yangyang, ZHENG Jinbao, YU Si, YAN Xiaomei, and WANG Mingliang
DONG Biqin, GUO Bangwen, LIU Yuqing, YAO Wanqiong, HONG Shuxian, and XING Feng
YUAN Qiuhua1, WAN Lei1, SHI Xin1, LIN Yaning2, XU Anping1, ZHANG Ziqiang1, CHEN Zehui1, and ZHANG Peixin1
Electronics and Information Science
LIU Binqing1, 2, WU Jiangtao3, CHEN Huaxin3, and HE Rui2, 3
LI Chan1,2, WANG Junjie1, WU Guofeng1, and LI Qingquan1
HU Penghui1, WANG Na1, WANG Yi1, WANG Huifang2, WANG Tianfu1, and NI Dong1
LIU Gang1, CHIN C T1, LI Xianming2, ZHENG Xiyuan2, LI Weihao2, LIN Yunzheng3, XIE Bing3, and DIAO Xianfen1