Information
JOURNAL OF SHENZHEN UNIVERSITY SCIENCE AND ENGINEERING
(Started in 1984, Bimonthly)
Responsible Institution
Shenzhen University
Sponsor
Shenzhen University
Edited by
Editorial Department of Journal of Shenzhen University Science and Engineering
Science Press
Chief editor
Li Qingquan
Distributed Domestically
Shenzhen Post Office
Distributed Abroad
China International Book Trading Corporation,(P.O.Box 399.Beijing,P.R.China)
Address
16 Donghuangchenggen North Street, Beijing 100717, P.R. China
Tel
0755-26732266
0755-26538306
Email:
journal@szu.edu.cn
 The Journal of Shenzhen University Science and Engineering is a general science and technology academic journal, managed and produced by Shenzhen University, and published by Science Press.It was first published in 1984. It is issued on a bimonthly basis (appearing on odd months) as an A4, 112-page magazine, distributed both domestically and overseas.
  The Journal publishes articles and letters covering a wide range of fields, including optoelectronic engineering, electronics & information science, architecture & civil engineering, chemistry & chemical engineering, automation & precision instruments, materials science, mathematics, physics, bioengineering, environmental science & energy, and food safety.
  The Journal is recognized as a core Chinese science and technology journal by the Overview of Core Chinese Periodicals (published by the Peking University Library) and the Statistical Source Journal for Chinese Science and Technology Articles (published by the Institute of Scientific and Technical Information of China [ISTIC]). It is also indexed by many authoritative domestic and international databases, including the Chinese Science Citation Database (CSCD), the Annual Report for Chinese Academic Joural Impact Factors (Natural Science), SCOPUS (based in the Netherlands), and Zentralblatt MATH (based in Germany). The Journal’s 2016 impact factor was 0.807, and the 2016 5-year impact factor was 0.827.
  We warmly welcome high-quality contributions from researchers and scholars from around the world!
Current Issue
Accepted Paper
In Press
Materials Science
Shi Chuan, Li Yongliang, Ren Xiangzhong, Deng Libo, Gao Yuan, and Zhang Peixin
Xie Shiqian1,2, Yu Jiang1,2, Tao Hongqun3, Ran Zongxin1,2, Wang Yating3, Guo Xin3, and Peng Weidong1,2
Electronics and Information Science
Qin Zhiwu1, Xie Jinxiong1, Cai Yi’na1, and Yan Yixuan1,2
Wan Xiaofeng, Ding Xiaohua, Nie Xiaoyi, Liu Zhiyu, Hu Hailin, and Yu Yunjun
Architecture & Civil Engineering
Liu Yuqing1,2, Dong Peng2, Teng Xiaojuan2, He Linlong2, Hong Shuxian2, Dong Biqin2, and Xing Feng1,2
Bioengineering
Sun Jinxia1, Wang Rui2, Tan Xiao3, Jiao Chenchen4, and Huang Zhong1
Cheng Hua, Yang Meiyan, Wu Jiahui, Sun Nan, Huang Jianzi, Zheng Yizhi, and Liu Yun
Environment and Energy
Jiang Yun1, Yang Xianyou1, Li Yue2, Shi Yang1, Xu Guoqing1, and Yu Yue3
Zhao Zhenfeng1, Tang Meirong1, Du Xianfei1, An Jie1, Cai Mingyu2, Su Yuliang2, and Wang Wendong2
Sun Dayin1, Xiong Jie2, Fan Mengqi2, Li Dan3, Cao Ziyang4, and Shao Guolin2